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Issue #2003 - 07 (February 2003)
(Updated Feb. 27, 2003)


Intel Taps Etenna For Notebook Antennas

Intel and Etenna Corporation Collaborate on Antenna Solution for Next-Generation of Wireless Notebook Platforms

LAUREL, MD, February 25, 2003 — Etenna Corporation, an antenna developer for commercial wireless applications, and Intel®, are collaborating to create an antenna solution for high performance wireless-enabled notebook computers. Original equipment manufacturers (OEMs) and original design manufacturers (ODMs) can use this reference design to directly address co-existence and incorporate 802.11a/b and Bluetooth™ antennas into their future products.

Etenna and Intel have been working together for almost a year to apply cutting edge antenna and surface treatment technology to Intel’s reference design mobile platforms to provide outstanding mobile connectivity. 

Specifically, the two companies have been using Etenna’s artificial magnetic conductor (AMC) technology to enhance the performance of internal antennas. Etenna’s AMC technology is an electrically thin, loss-less material that blocks surface waves. The AMC material itself is not composed of any exotic compounds, but uses traditional materials to create a periodic structure with distributed inductors and capacitors. Small amounts of this material are required for this type of application, resulting in a small size and low profile surface treatment.

“We are strategically placing ‘RF speed bumps’ along the edge of the laptop screen to reduce surface currents created by the antennas,” says Greg Mendolia, Etenna’s Executive Vice President. “Applying this treatment between antennas embedded into laptops dramatically improves in-band isolation by over 20 dB. Without this treatment, the isolation is typically 20–25 dB, but with the treatment isolation in excess of 45 dB has been achieved within Intel’s specified form factor.”

By enhancing antenna isolation, interference between protocols such as Bluetooth, and 802.11b/g is significantly reduced. This creates more reliable wireless connectivity at improved data rates and increased range when the two protocols are operated simultaneously—one application no longer has to be turned off while the other one runs. The results from this collaboration were showcased at one of the technical sessions jointly given by Intel and Etenna at the Spring 2003 Intel Developer Forum (IDF), an event sponsored by Intel to demonstrate the latest technologies going into computing devices. Etenna provided a live demo, which showed the audience real-time improvement in isolation by adding small strips of AMC on a laptop. Multiple sessions at the IDF emphasized the importance of achieving at least 40 dB of antenna isolation to obtain optimum performance with both Bluetooth and 802.11b/g.

About Intel
Intel, the world’s largest chip maker, is also a leading manufacturer of computer, networking and communications products. Additional information about Intel is available at www.intel.com/pressroom.

About Etenna Corporation
Headquartered in Laurel, Md., Etenna Corporation designs and produces antennas for applications ranging from mobile phones to 802.11 and Bluetooth™ wireless devices. Employing Etenna’s proprietary antenna technologies, the company significantly improves the size, performance and cost of wireless devices and equipment. In addition, Etenna makes use of patented Artificial Magnetic Conductor (AMC) technology to enable high antenna performance and isolation in an attractive form factor for wireless products. Backed by a dedicated team of researchers and design engineers, Etenna’s intellectual property (IP) portfolio includes more than 30 issued or pending patents. 

Source: Etenna press release
For more information: http://www.etenna.com

MobileInfo Comments and Advisory: Etenna's innovation is very innovative. As notebooks (and PDAs in future) become multi-band devices that operate on different frequencies, you need antenna isolation technologies. We hope Etenna can figure out implications of this in software radios.

Note: This news release may contain forward-looking statements within the meaning of section 27A of the Securities Act of 1933 and section 21E of Securities Exchange act of 1934 in USA. Similar provisions exist in other countries. There is no assurance that the stipulated plans of vendors will be implemented. MobileInfo does not warrant the authenticity of the information. Readers should take appropriate caution in developing plans utilizing these products, services and technology architectures.  All trademarks used in this summary are the property of their respective owners.

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