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Issue #2003 - 19 (June 2003)
(Updated June 19, 2003)


Recent VC Investments in Wireless 

1. Trapeze Networks Raises $34M round
WLAN networking start-up Trapeze Networks today announced $34 million in second round financing. Oak Investment Partners of Palo Alto, California, led the round with $12 million. Trapeze received additional funding from Duff Ackerman & Goodrich, Castile Ventures, Trautman Wasserman & Co., and C.E. Unterberg Towbin, as well as its original team of first round investors, including Accel Partners and Redpoint Ventures. This $34 million second round is one of the largest in the wireless industry this year. Trapeze designs WLAN networking solutions for the enterprise. Their main product, the WLAN Mobility System, allows for secure user roaming between networks and for better WLAN network management.

2. Alphamosaic closes $12M second round
Mobile video maker Alphamosaic today said it closed a $12 million second round led by Doughty Hanson Technology Ventures. Existing investors Prelude, ACT, and TTP Ventures participated in the round. Alphamosaic makes semiconductors and other devices that allow video on wireless networks.

3. Sybase to spend $25M to develop WiFi enterprise apps
Sybase announced at Supercomm that it plans to spend $25 million to help spur the development of and market enterprise applications for WiFi networks

4. Ziptronix, 3D circuit technology manufacturer, raises $17 million
Start-up Ziptronix of Research Triangle Park, North Carolina, has completed a $17.4 million second round of financing and already claims several major technology companies as customers. The second round was led by Grotech Capital Group and Intersouth Partners, and will accelerate development of custom three-dimensional circuits aimed at wireless communications, WiFi, and other networking applications. Last year Ziptronix introduced its ZiROC adhesive-free semiconductor bonding technology and ZiCON 3D interconnect technology for commercial applications. These combined technologies provide potential for dense 3D semiconductor applications, wafer-scale MEMS encapsulation solutions, and custom-engineered semiconductor substrates. The financing is also to be used to complete a volume manufacturing facility, where the company plans to make custom-engineered substrates based on the company's proprietary ZiROC room temperature, adhesive-free bonding technology.

For more information: http://www.venturereporter.com

MobileInfo Comments and Advisory: Action is in the silicon and Wi-Fi. Sybase's commitment to Wi-Fi is noteworthy.

Note: This news release may contain forward-looking statements within the meaning of section 27A of the Securities Act of 1933 and section 21E of Securities Exchange act of 1934 in USA. Similar provisions exist in other countries. There is no assurance that the stipulated plans of vendors will be implemented. MobileInfo does not warrant the authenticity of the information. Readers should take appropriate caution in developing plans utilizing these products, services and technology architectures.  All trademarks used in this summary are the property of their respective owners.

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